Metal Technology Co. Ltd.




Cooling plate for LCD/Semiconductor

Customer’s problem

  • Depletion of aluminum was severe due to its weak tolerance to etching though it has good heat conduction.

Our proposal

  • We proposed to use SUS pipes in internal passage which increases corrosion resistance and to bond different materials, SUS and aluminum by HIP treatment.
Cooling plate


The tolerance to etching increased by using SUS pipe and reduced its depletion.

Compact electron beam irradiation device

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Document download

  • Company information
  • Technology information (Japanese)
  • Technology information (English)
  • HIP unit list
  • Hot press equipment list
  • Possible material combinations for brazing
  • MICROTRON Test Machine MIC1
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