Bonding / Metal Technology Co. Ltd.

Metal Technology Co. Ltd.

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Bonding

How does the hot press process compare to HIP for cost?

Since HIP requires additional processes, such as capsule design, construction, and evacuation inside the capsule, processing products with HIP tends to be more expensive than the Hot Press process. However, there are several advantages to both processes depending on the result desired by the customer. comment - Link to HIP - https://www.kinzoku.co.jp/en/core_technology/hip.html

What is the result of the bonding process at the interface?

Since the atoms of the bonded metals are integrated together, the layer is very thin, about 1 micron.

How do you pressurize the HIP unit?

There is a high-pressure compressor on the outside of the unit which pressurizes the HIP during processing.

What metals are suitable for bonding using the HIP process?

Most metals can be HIPed and some of the common metals we process are copper, aluminum, stainless steel, titanium, and tantalum, etc. Please contact us with your specific needs.

Is the aluminum 7000 series not suitable for HIP bonding?

HIP bonding slowly cools strong metals, resulting in annealing.

Does MTC have experience with diffusion bonding CoCr and a titanium alloy?

Here at MTC we have processed several combinations of materials including pure titanium and pure copper. Please contact us for a specific combination of materials.

What is the level of precision of the bonded section for the two processes of HIPping and hot press?

The hot press bond is 99% when the component processing accuracy and conditions are met and 100% when the HIP conditions are met.

How many hot press units does MTC have?

MTC has nine Hot Press units with a variety of working zones and pressures.

What is the required surface roughness for the bonding surface?

It is approximately Ra6.3.

Are there any alloys that are difficult to bond with the HIP process?

There are some challenging materials when using the HIP process, however HIP is excellent at bonding dissimilar materials.

Doesn't the capsule material bond to the product when HIPping?

Yes, the capsule does bond to the product but this is removed after HIPping or Heat Treatment through pickling or machining. MTC has extensive experience with capsule removal and techniques to ensure the products integrity.

Are there any dimensional differences between the capsules before and after HIPing?

If solid pieces are being HIPped, then no significant changes occur. However, during NNS or powder sintering deformation will occur. This is taken into consideration during the design and powder filling process to ensure the intended results are achieved. In regards to solid metal products being bonded together through the use of HIP, if the product does not have an internal flow path there may be micron-level changes. However there would be no dimensional changes as can be seen when measured with a ruler.

What happens if you create a space inside and HIP it?

As long as it is open to the atmosphere, no deformation will occur. Any openings or porosity that is not exposed to the atmosphere, will be eliminated. If the space is internal it will be closed by the HIP process.

What is the bonding strength at the bonding interface?

It depends on the combination of joining materials. For example, the combination of SUS304 and C1020 has higher joint surface strength than the base material of C1020.

How can I decided what the best process is to match my cost and bond surface requirements?

Here at MTC we have vast experience in using both processes and a wide selection of equipment which we can propose to achieve the best and most suitable bonding method in terms of cost for the required quality.

What kind of methods are available for evaluation and inspection of bonded surfaces for diffusion bonding and HIP treatment?

We perform leak inspections (Helium leak test) and tensile tests.

When you manufacture mass produced parts how do you ensure the quality?

Here at MTC we have and utilize constant process control and quality assurance guaranteeing the process is performed correctly and accurately every time.

I want to bond aluminum and copper together by methods other than brazing.

MTC can offer alternative options to match your needs and requirements through diffusion bonding processes. As each case is specific and MTC matches the process to the customers needs we suggest that you contact us with the details and we can provide you with a customer specific suggestion.

At the time of diffusion bonding of SUS304, if the surface phase of the part is Ra6 or less, it will be a mirror surface. A carbon pressure jig is recommended, but can the two react?

SUS304 and carbon jig may react a little and fuse. Basically, it is better to include the finishing process after bonding.

Are there no internal stresses after HIP?

Internal stress is generated. However, since the cooling rate of the bonded interface is slow, the stress is generally released.

Compact electron beam irradiation device

Contact Us

+81-3-5365-3035

+81-3-5365-3055

Any request about products, and ask for quotation can be made here. Other questions and requests about the company can also be made here.

Document download

  • Company information
  • Technology information (Japanese)
  • Technology information (English)
  • HIP unit list
  • Hot press equipment list
  • Possible material combinations for brazing
  • MICROTRON Test Machine MIC1
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