Most metals can be HIPed and some of the common metals we process are copper, aluminum, stainless steel, titanium, and tantalum, etc. Please contact us with your specific needs.

The hot press bond is 99% when the component processing accuracy and conditions are met and 100% when the HIP conditions are met.

It is approximately Ra6.3.

It depends on the combination of joining materials. For example, the combination of SUS304 and C1020 has higher joint surface strength than the base material of C1020.

There are some challenging materials when using the HIP process, however HIP is excellent at bonding dissimilar materials.

No, basically, there is no problem with normal metal processing.

It depends on the bonding conditions. In the best case of bonding, the strength of the bond is equal to that of the base metal.

Combinations that have large solid solution limits to each other in the two-dimensional state diagram are easy to diffusion bond.

Metals with very different expansion coefficients and melting points do not match well.

Temperature has a greater impact.

Some types of metal components tend to form intermetallic compounds. If a large number of intermetallic compounds are formed, they will break off from there, so it is necessary to create a combination that prevents the formation of intermetallic compounds. MTC has both the experience and know-how to resolve this issue if required.

Yes, the capsule does bond to the product but this is removed after HIPping or Heat Treatment through pickling or machining. MTC has extensive experience with capsule removal and techniques to ensure the products integrity.

Since the atoms at the bonding interface are diffusion bonded together, the layer is very thin, about 1 micron.

Yes, in rare cases two components are placed in one capsule, but basically they are made product by product.

Each capsule is only used once.

Metals with good weldability, such as iron-based and stainless steel-based metals, are generally used.

Defects that are not externally exposed (meaning internal defects) do not require canning (encapsulation). HIP is possible with the bulk material as it is.

Here at MTC we have processed several combinations of materials including pure titanium and pure copper. Please contact us for a specific combination of materials.

MTC can offer alternative options to match your needs and requirements through diffusion bonding processes. As each case is specific and MTC matches the process to the customers needs we suggest that you contact us with the details and we can provide you with a customer specific suggestion.

Depending on the shape of the bonded part, brazing is recommended if it is metal and ceramics; MTC normally braze's metal and alumina. There is no established technique for bonding metals and ceramics by HIP.

Depending on the shape of the bonded part, it is possible to bond alumina and metal by brazing. Bonding of brittle materials is also possible if sufficient diffusion occurs. However, due to the effect of different expansion coefficients between the capsule material and the product, the capsule often cracks after HIP.

Canning (encapsulation) is also required when ceramics are bonded together by HIP. This is because it is difficult to produce a capsule that can withstand the temperature at which ceramics diffuse.

It is possible to bond by HIP. However, there are various conditions for titanium. Please contact us for details.

If canning (encapsulation) is possible, it is possible.

Hot press is more suitable for diffusion bonding of thin plate products than HIP. It is also less expensive. Hot pressing is also available at MTC, so please contact us.

HIP bonding slowly cools strong metals, resulting in annealing.

SUS304 and carbon jig may react a little and fuse. Basically, it is better to include the finishing process after bonding.

Internal stress is generated. However, since the cooling rate of the bonded interface is slow, the stress is generally released.

There is a high-pressure compressor on the outside of the unit which pressurizes the HIP during processing.

HIP at a temperature higher than the recrystallization temperature will cause recrystallization. Whether recrystallization should occur depends on the mechanical properties (strength/viscosity) the product is intended for, so please contact us for details.

As long as it is open to the atmosphere, no deformation will occur. Any openings or porosity that is not exposed to the atmosphere, will be eliminated. If the space is internal it will be closed by the HIP process.

Since HIP requires additional processes, such as capsule design, construction, and evacuation inside the capsule, processing products with HIP tends to be more expensive than the Hot Press process. However, there are several advantages to both processes depending on the result desired by the customer. comment - Link to HIP - https://www.kinzoku.co.jp/en/core_technology/hip.html

Here at MTC we have vast experience in using both processes and a wide selection of equipment which we can propose to achieve the best and most suitable bonding method in terms of cost for the required quality.

MTC has nine Hot Press units with a variety of working zones and pressures.

The Giga-HIP (equipment name) at Himeji Plant can be used up to about φ1900.

We perform leak inspections (Helium leak test) and tensile tests.

Here at MTC we have and utilize constant process control and quality assurance guaranteeing the process is performed correctly and accurately every time.

Temperature is controlled by attaching thermocouples inside the furnace. If requested, we can also attach thermocouples to the actual product for entity temperature control.

This can be confirmed by X-ray inspection and ultrasonic testing.

We regularly measure the purity of the Ar gas we use.